Technology [ 8/11 ] | Semiconductors [ 132/148 ]
US | NASDAQ | Stock
| Reported Date | EPSChange YoY | EstimateSurprise |
|---|---|---|
| Jul 31, 23 | 0.26 Decreased by -49.02% | 0.21 Increased by +23.81% |
| May 1, 23 | 0.18 Decreased by -73.91% | 0.17 Increased by +5.88% |
| Feb 13, 23 | 0.67 Increased by +31.37% | 0.70 Decreased by -4.29% |
| Oct 31, 22 | 1.24 Increased by +153.06% | 0.93 Increased by +33.33% |
| Aug 1, 22 | 0.51 Decreased by -1.92% | 0.48 Increased by +6.25% |
| May 2, 22 | 0.69 Increased by +81.58% | 0.57 Increased by +21.05% |
| Jul 26, 21 | 0.51 Increased by +121.74% | 0.42 Increased by +21.43% |
| Apr 26, 21 | 0.49 Increased by +88.46% | 0.46 Increased by +6.52% |
| Fiscal ending date | RevenueChange YoY | IncomeChange YoY | ProfitChange YoY |
|---|---|---|---|
| Jun 30, 23 | 1.46 B Decreased by -3.12% | 64.29 M Decreased by -48.48% | Increased by +4.41% Decreased by -46.82% |
| Mar 31, 23 | 1.47 B Decreased by -7.85% | 45.35 M Decreased by -73.51% | Increased by +3.08% Decreased by -71.26% |
| Dec 31, 22 | 1.91 B Increased by +10.53% | 164.30 M Decreased by -24.38% | Increased by +8.62% Decreased by -31.59% |
| Sep 30, 22 | 2.08 B Increased by +23.96% | 306.08 M Increased by +69.24% | Increased by +14.69% Increased by +36.53% |
| Jun 30, 22 | 1.50 B Increased by +6.99% | 124.78 M Decreased by -0.82% | Increased by +8.29% Decreased by -7.30% |
| Mar 31, 22 | 1.60 B Increased by +20.41% | 171.23 M Increased by +42.92% | Increased by +10.72% Increased by +18.69% |
| Dec 31, 21 | 1.72 B Increased by +25.79% | 217.28 M Increased by +71.53% | Increased by +12.60% Increased by +36.36% |
| Sep 30, 21 | 1.68 B Increased by +24.15% | 180.85 M Increased by +96.26% | Increased by +10.76% Increased by +58.08% |
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.