Technology [ 10/13 ] | Semiconductor Equipment & Materials [ 132/159 ]
NASDAQ | Common Stock
Reported Date | EPSChange YoY | EstimateSurprise |
---|---|---|
Jan 24, 24 | 7.52 Decreased by -29.79% | 7.1 Increased by +5.92% |
Oct 18, 23 | 6.85 Decreased by -34.26% | 6.12 Increased by +11.93% |
Jul 26, 23 | 5.98 Decreased by -32.28% | 5.07 Increased by +17.95% |
Apr 19, 23 | 6.99 Decreased by -5.54% | 6.54 Increased by +6.88% |
Jan 25, 23 | 10.71 Increased by +25.56% | 9.96 Increased by +7.53% |
Oct 19, 22 | 10.42 Increased by +24.64% | 9.54 Increased by +9.22% |
Jul 27, 22 | 8.83 Increased by +9.15% | 7.32 Increased by +20.63% |
Apr 20, 22 | 7.4 Decreased by -1.2% | 7.51 Decreased by -1.46% |
Fiscal ending date | RevenueChange YoY | IncomeChange YoY | ProfitChange YoY |
---|---|---|---|
Dec 31, 23 | 3.76 B Decreased by -28.79% | 954.27 M Decreased by -35.02% | Increased by +25.39% Decreased by -8.75% |
Sep 30, 23 | 3.48 B Decreased by -31.38% | 887.4 M Decreased by -37.76% | Increased by +25.48% Decreased by -9.31% |
Jun 30, 23 | 3.21 B Decreased by -30.81% | 802.54 M Decreased by -33.62% | Increased by +25.02% Decreased by -4.05% |
Mar 31, 23 | 3.87 B Decreased by -4.7% | 814.01 M Decreased by -20.33% | Increased by +21.04% Decreased by -16.41% |
Dec 31, 22 | 5.28 B Increased by +24.87% | 1.47 B Increased by +22.91% | Increased by +27.83% Decreased by -1.57% |
Sep 30, 22 | 5.07 B Increased by +17.88% | 1.43 B Increased by +20.86% | Increased by +28.1% Increased by +2.53% |
Jun 30, 22 | 4.64 B Increased by +11.83% | 1.21 B Increased by +5.62% | Increased by +26.08% Decreased by -5.56% |
Mar 31, 22 | 4.06 B Increased by +5.53% | 1.02 B Decreased by -4.61% | Increased by +25.16% Decreased by -9.61% |
Lam Research Corporation designs, manufactures, markets, refurbishes, and services semiconductor processing equipment used in the fabrication of integrated circuits. The company offers ALTUS systems to deposit conformal films for tungsten metallization applications; SABRE electrochemical deposition products for copper interconnect transition that offers copper damascene manufacturing; SOLA ultraviolet thermal processing products for film treatments; and VECTOR plasma-enhanced CVD ALD products. It also provides SPEED gapfill high-density plasma chemical vapor deposition products; and Striker single-wafer atomic layer deposition products for dielectric film solutions. In addition, the company offers Flex for dielectric etch applications; Kiyo for conductor etch applications; Syndion for through-silicon via etch applications; and Versys metal products for metal etch processes. Further, it provides Coronus bevel clean products to enhance die yield; Da Vinci, DV-Prime, EOS, and SP series products to address various wafer cleaning applications; and Metryx mass metrology systems for high precision in-line mass measurement in semiconductor wafer manufacturing. The company sells its products and services to semiconductors industry in the United States, China, Europe, Japan, Korea, Southeast Asia, Taiwan, and internationally. The company was incorporated in 1980 and is headquartered in Fremont, California.