Technology [ 10/13 ] | Semiconductor Equipment & Materials [ 98/159 ]
NASDAQ | Common Stock
| Reported Date | EPSChange YoY | EstimateSurprise |
|---|---|---|
| Apr 9, 24 | -0.03 Decreased by -118.75% | -0.04 Increased by +25% |
| Jan 9, 24 | 0.23 Increased by +43.75% | 0.19 Increased by +21.05% |
| Oct 5, 23 | 0.18 Increased by +260% | 0.16 Increased by +12.5% |
| Jul 13, 23 | 0.23 Increased by 0% | 0.22 Increased by +4.55% |
| Mar 30, 23 | 0.16 Increased by +14.29% | 0.14 Increased by +14.29% |
| Jan 5, 23 | 0.16 Increased by +220% | 0.09 Increased by +77.78% |
| Oct 6, 22 | 0.05 Increased by +350% | 0.01 Increased by +400% |
| Jul 19, 22 | 0.23 Increased by +475% | 0.23 |
| Fiscal ending date | RevenueChange YoY | IncomeChange YoY | ProfitChange YoY |
|---|---|---|---|
| Nov 30, 23 | 21.43 M Increased by +44.66% | 6.09 M Increased by +63.46% | Increased by +28.41% Increased by +13% |
| Aug 31, 23 | 20.62 M Increased by +93.27% | 4.67 M Increased by +693.55% | Increased by +22.66% Increased by +310.59% |
| May 31, 23 | 22.27 M Increased by +9.76% | 6.11 M Increased by +5.47% | Increased by +27.44% Decreased by -3.91% |
| Feb 28, 23 | 17.21 M Increased by +12.58% | 4.13 M Increased by +84.22% | Increased by +24.01% Increased by +63.63% |
| Nov 30, 22 | 14.81 M Increased by +54.15% | 3.73 M Increased by +419.53% | Increased by +25.14% Increased by +237.03% |
| Aug 31, 22 | 10.67 M Increased by +89% | 589 K Decreased by -15.37% | Increased by +5.52% Decreased by -55.22% |
| May 31, 22 | 20.29 M Increased by +165.63% | 5.79 M Increased by +921.87% | Increased by +28.56% Increased by +284.69% |
| Feb 28, 22 | 15.28 M Increased by +190.17% | 2.24 M Increased by +405.17% | Increased by +14.68% Increased by +205.17% |
Aehr Test Systems provides test solutions for testing, burning-in, and semiconductor devices in wafer level, singulated die, and package part form, and installed systems worldwide. Its product portfolio includes FOX-XP and FOX-NP systems that are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize range of devices, including silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The company also offers FOX-CP system, a low-cost single-wafer compact test solution for logic, memory, and photonic devices; FOX WaferPak Contactor, a full wafer contactor capable of testing wafers up to 300mm that enables integrated circuit manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. In addition, it provides FOX DiePak Carrier, a reusable temporary package that enables IC manufacturers to perform final test and burn-in of bare die and modules; and FOX DiePak Loader. The company was incorporated in 1977 and is headquartered in Fremont, California.