Price
$16.24
Increased by +1.95%
Dollar Volume (20D)
21.15 M
ADR%
5.78
Earnings Report Date (estimate)
Mar 28, 24
Shares Float
27.27 M
Shares Outstanding
28.85 M
Shares Short
6.08 M
Market Cap.
459.57 M
Beta
2.03
Price / Earnings
22.44
20D Range
14.54 19.06
50D Range
14.54 30
200D Range
14.54 54.1
  • Quarterly Earnings
  • Annual Earnings
Reported Date EPSChange YoY EstimateSurprise
Jan 9, 24 0.23
Increased by +43.75%
0.19
Increased by +21.05%
Oct 5, 23 0.18
Increased by +260%
0.16
Increased by +12.5%
Jul 13, 23 0.23
Increased by 0%
0.22
Increased by +4.55%
Mar 30, 23 0.16
Increased by +14.29%
0.14
Increased by +14.29%
Jan 5, 23 0.16
Increased by +220%
0.09
Increased by +77.78%
Oct 6, 22 0.05
Increased by +350%
0.01
Increased by +400%
Jul 19, 22 0.23
Increased by +475%
0.23
Mar 31, 22 0.14
Increased by +800%
0.14
  • Quarterly Financials
  • Annual Financials
Fiscal ending date RevenueChange YoY IncomeChange YoY ProfitChange YoY
Nov 30, 23 21.43 M
Increased by +44.66%
6.09 M
Increased by +63.46%
Increased by +28.41%
Increased by +13%
Aug 31, 23 20.62 M
Increased by +93.27%
4.67 M
Increased by +693.55%
Increased by +22.66%
Increased by +310.59%
May 31, 23 22.27 M
Increased by +9.76%
6.11 M
Increased by +5.47%
Increased by +27.44%
Decreased by -3.91%
Feb 28, 23 17.21 M
Increased by +12.58%
4.13 M
Increased by +84.22%
Increased by +24.01%
Increased by +63.63%
Nov 30, 22 14.81 M
Increased by +54.15%
3.73 M
Increased by +419.53%
Increased by +25.14%
Increased by +237.03%
Aug 31, 22 10.67 M
Increased by +89%
589 K
Decreased by -15.37%
Increased by +5.52%
Decreased by -55.22%
May 31, 22 20.29 M
Increased by +165.63%
5.79 M
Increased by +921.87%
Increased by +28.56%
Increased by +284.69%
Feb 28, 22 15.28 M
Increased by +190.17%
2.24 M
Increased by +405.17%
Increased by +14.68%
Increased by +205.17%
Open dropdown content
Open dropdown content
DAILY
WEEKLY
MONTHLY

Aehr Test Systems provides test solutions for testing, burning-in, and semiconductor devices in wafer level, singulated die, and package part form, and installed systems worldwide. Its product portfolio includes FOX-XP and FOX-NP systems that are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize range of devices, including silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The company also offers FOX-CP system, a low-cost single-wafer compact test solution for logic, memory, and photonic devices; FOX WaferPak Contactor, a full wafer contactor capable of testing wafers up to 300mm that enables integrated circuit manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. In addition, it provides FOX DiePak Carrier, a reusable temporary package that enables IC manufacturers to perform final test and burn-in of bare die and modules; and FOX DiePak Loader. The company was incorporated in 1977 and is headquartered in Fremont, California.