Technology [ 11/13 ] | Semiconductor Equipment & Materials [ 81/159 ]
NASDAQ | Common Stock
| Reported Date | EPSChange YoY | EstimateSurprise |
|---|---|---|
| Feb 28, 24 | 0.43 Increased by +126.32% | 0.17 Increased by +152.94% |
| Nov 7, 23 | 0.57 Increased by +26.67% | 0.34 Increased by +67.65% |
| Aug 4, 23 | 0.48 Increased by +118.18% | 0.12 Increased by +300% |
| May 5, 23 | 0.15 Increased by +1.6 K% | 0.08 Increased by +85.64% |
| Feb 24, 23 | 0.19 Decreased by -29.63% | 0.14 Increased by +35.71% |
| Nov 4, 22 | 0.45 Increased by +136.84% | 0.24 Increased by +87.5% |
| Aug 5, 22 | 0.22 Increased by +266.67% | 0.05 Increased by +340% |
| May 6, 22 | -0.01 Decreased by -108.33% | 0.01 Decreased by -200% |
| Fiscal ending date | RevenueChange YoY | IncomeChange YoY | ProfitChange YoY |
|---|---|---|---|
| Sep 30, 23 | 168.57 M Increased by +26.07% | 25.68 M Increased by +22.26% | Increased by +15.23% Decreased by -3.03% |
| Jun 30, 23 | 144.58 M Increased by +38.49% | 26.82 M Increased by +60.17% | Increased by +18.55% Increased by +15.65% |
| Mar 31, 23 | 74.26 M Increased by +76.02% | 7.14 M Increased by +196% | Increased by +9.62% Increased by +154.54% |
| Dec 31, 22 | 108.54 M Increased by +14.08% | 11.81 M Decreased by -24.13% | Increased by +10.88% Decreased by -33.5% |
| Sep 30, 22 | 133.71 M Increased by +99.53% | 21 M Increased by +106.83% | Increased by +15.71% Increased by +3.66% |
| Jun 30, 22 | 104.39 M Increased by +93.81% | 16.75 M Increased by +155.03% | Increased by +16.04% Increased by +31.59% |
| Mar 31, 22 | 42.19 M Decreased by -3.54% | -7.44 M Decreased by -236.07% | Decreased by -17.64% Decreased by -241.06% |
| Dec 31, 21 | 95.14 M Increased by +108.82% | 15.56 M Increased by +82.5% | Increased by +16.36% Decreased by -12.61% |
ACM Research, Inc., together with its subsidiaries, develops, manufactures, and sells single-wafer wet cleaning equipment for enhancing the manufacturing process and yield for integrated chips worldwide. It offers space alternated phase shift technology for flat and patterned wafer surfaces, which employs alternating phases of megasonic waves to deliver megasonic energy in a uniform manner on a microscopic level; timely energized bubble oscillation technology for patterned wafer surfaces at advanced process nodes, which provides cleaning for 2D and 3D patterned wafers; Tahoe technology for delivering cleaning performance using less sulfuric acid and hydrogen peroxide; and electro-chemical plating technology for advanced metal plating. The company markets and sells its products under the SAPS, TEBO, ULTRA C, ULTRA Fn, Ultra ECP, Ultra ECP map, and Ultra ECP ap trademarks through direct sales force and third-party representatives. ACM Research, Inc. was incorporated in 1998 and is headquartered in Fremont, California.